Hardware Selection Guide*

This webpage lists the main functional parameters of the chip and other related resources and indicators in a table for selection. Users can click on the content in the chip data manual row and the module model in the table below to enter the corresponding data manual document page.

Voice AI chip selection*

Chip Model Parameters	Selection Guide - AI Series
Chip Model Parameters	GX8009B	GX8008	GX8008C	GX8002	GX8003	GX8005	GX8006
Market Positioning	Intelligent Voice Master SoC	Multi-microphone Intelligent Voice DSP	Multi-microphone Intelligent Voice DSP	Ultra-low Power Voice Processor	Offline Voice Recognition Chip	High-performance Offline Voice Recognition Chip	High-performance Offline Voice Recognition Chip
Packaging	QFN88 （10mm*10mm）	QFN88 （10mm*10mm）	QFN52 （6mm*6mm)	QFN20 （3mm*3mm）	S0P16	S0P8	S0P24
ADC	6CH (16bit)	6CH (16bit)	4CH（24bit）	1CH (12bit)	1CH (12bit)	1CH (16bit)	2CH (16bit)
PDM	6DMIC	6DMIC	4DMIC	2DMIC	2DMIC	——	——
DSP	HiFi-4 （400MHz)	HiFi-4 (400MHz)	HiFi-4 （400MHz)	——	——	——	——
MCU	32bit RISC MCU （CK802 150MHz)	32bit RISC MCU （CK802 150MHz)	32bit RISC MCU （CK802 150MHz)	32bit RISC MCU （CK804 50MHz)	32bit RISC MCU （CK804 50MHz)	32bit RISC-V CPU with I/D Cache, DSP and FPU. Up to 200MHz	32bit RISC-V CPU with I/D Cache, DSP and FPU. Up to 200MHz
SNPU	MAC(32) 12G flops（float16）	MAC(32) 12G flops（float16）	——	gxNPU V200 (800M flops) (float16)	gxNPU V200 （800M flops）（float16）	gxNPU V122 (800M flops) (float16)	gxNPU V122 (800M flops) (float16)
SRAM	1.5MB	1.5MB	1.5MB	208KB	208KB	176KB	176KB
FLASH	——	——	6 lines (100MHz)	256K/512K/1M Bytes	1M Bytes	1M Bytes	2M Bytes
FLASH	——	——	6 lines (100MHz)	6 lines (50MHz)	6 lines (60MHz)	6 lines (100MHz)	6 lines (120MHz)
Audio DAC	√	√	√	√	√	√	√
Audio PA	——	——	——	——	——	√	√
I2S	1 in(M/S) + 1 in(S)	1 in(M/S) + 1 in(S)	1 in(S)	1 in(M/S)	——	——	1 in(M/S) + 1 in(S)
I2S	1 out(M)	1 out(M)	1 out(M)	1 out(M/S)	——	——	1 out(M)
USB	1Host+1Slave	1Slave	1Slave	——	——	——	——
UART	1+2	1	2	2	2	2	3
I2C	1+2	1	2	2	1	1	1
SPI	1+2	1	2	1	1	——	1 (QSPI master) + 2 (SPI M/S)
SDIO	2	——	——	——	——	——	——
IR	——	——	——	——	——	——	√
CPU	ARM_A7 (1.0GHZ)	——	——	——	——	——	——
NPU	MAC(64) 38Gflops(float16)	——	——	——	——	——	——
Built-in DDR	128MB	——	——	——	——	——	——
Standby power consumption	43mW	40mW	25mW	<100uW	<5mW	——	——
OS	Linux	NO OS	NO OS	NO OS	NO OS	NO OS	NO OS
Features	Complete solution for smart speakers Multi-microphone noise reduction, wake-up Offline ASR	Multi-microphone noise reduction, sound source positioning, wake-up command recognition	Multi-microphone noise reduction, sound source positioning, wake-up command recognition	Support low power consumption wake-up, noise reduction, short command control	Offline voice recognition command 100+	High-performance offline voice recognition command 100+	High-performance offline voice recognition, command 100+ Integrated infrared

Bluetooth AIoT chip selection*

Chip model parameters	Selection Guide - Bluetooth series
Chip model parameters	GX8301A	GX8301B	GX8302A	GX8302B	GX8303
Market positioning	Low power BLE	Low power BLE	Bluetooth AloT chip	Bluetooth AloT chip	Bluetooth IoT chip
Encapsulation	QFN32 （4mm*4mm)	QFN52 （6mm*6mm)	QFN32 （4mm*4mm)	QFN52 （6mm*6mm)	SOP8
ADC	1CH（16bit）	1CH（16bit）	1CH（16bit）	1CH（16bit）	——
PDM	2DMIC	2DMIC	2DMIC	2DMIC	——
MCU	32bit RISC-V CPU with I/D Cache, DSP and FPU. Up to 96MHz	32bit RISC-V CPU with I/D Cache, DSP and FPU. Up to 96MHz	32bit RISC-V CPU with I/D Cache, DSP and FPU. Up to 128MHz	32bit RISC-V CPU with I/D Cache, DSP and FPU. Up to 128MHz	32bit RISC CPU Frequency up to 64 MHz
SRAM	128KB	128KB	144kB	144kB+2MB PSRAM	Built-in 8KB Retention SRAM
FLASH	512KB	512KB	1MB	External	64KB ROM for BT stack and peripheral drivers 16kB OTP with online programming
FLASH	6line（85MHz)	6line（85MHz)	6line（85MHz)	External
Audio DAC	√	√	√	√	——
I2S	1(M/S) support TDMx4 mode 5-line in-out mode	1(M/S) support TDMx4 mode 5-line in-out mode	1(M/S) support TDMx4 mode 5-line in-out mode	1(M/S) support TDMx4 mode 5-line in-out mode	——
I2S	1(M/S) support TDMx4 mode 5-line in-out mode	1(M/S) support TDMx4 mode 5-line in-out mode	1(M/S) support TDMx4 mode 5-line in-out mode	1(M/S) support TDMx4 mode 5-line in-out mode	——
USB	USB 2.0 Full Speed slave	USB 2.0 Full Speed slave	hi说	USB 2.0 Full Speed slave	USB2.0 Full Speed slave
UART	2	2	2	2	1 (up to 1Mbps baud rate)
I2C	3	3	3	3	1 (100khz and 400khz)
SPI	2（QSPI M/S）	2（QSPI M/S）	2（QSPI M/S）	2（QSPI M/S）	1 (Master)
SDIO	SDIO 2.0 master	SDIO 2.0 master	SDIO 2.0 master	SDIO 2.0 master	——
SAR-ADC	8CH(12bit)	8CH(12bit)	8CH(12bit)	8CH(12bit)	Multi-channel(12bit)
IR	TX&RX	TX&RX	TX&RX	TX&RX	——
Key scan controller	matrix/determinant	matrix/determinant	matrix/determinant	matrix/determinant	——
Bluetooth	Bluetooth Low Energy V5.4 qualified	Bluetooth Low Energy V5.4 qualified	Bluetooth Low Energy V5.4 qualified	Bluetooth Low Energy V5.4 qualified	Bluetooth Low Energy V5.3 qualified Support 1Mbps, 2Mbps, and 125K/500K coded PHY Support 2.4G proprietary mode
BLE TX&RX	RX sensitivity: -96dBm TX power: 7dBm	RX sensitivity: -96dBm TX power: 7dBm	RX sensitivity: -96dBm TX power: 7dBm	RX sensitivity: -96dBm TX power: 7dBm	RX sensitivity: -96dBm TX power: 10dBm
Display	——	——	QSPI/SPI LCD display driver	QSPI/SPI LCD display driver	——
NPU	——	——	gxNPU V120 Integrated NPU for neural network proces	gxNPU V120 Integrated NPU for neural network proces	——
待机功耗	＜1uA @Deep Sleep	＜1uA @Deep Sleep	＜1uA @Deep Sleep	＜1uA @Deep Sleep	2uA @Sleep with 32Khz RTC
OS	RTOS	RTOS	RTOS	RTOS	——
特性	1.8~5.5 wide voltage, integrated infrared, USB 3xQDEC	1.8~5.5 wide voltage, integrated infrared, USB 3xQDEC	Support AI voice algorithm and support LE Audio	Supports AI voice algorithm, supports LVGL screen drive, supports LE Audio	3-channel PWM,SWD 3 Quadrature Decoder Real Timer Counter X4 32-bit Timer, and 1 Watchdog Timer